Flip Chip CSP Substrate: Efficiency, Reliability, and Application

A flip chip simply means that the chip is flipped over to make a connection with the substrate or lead frame. Flip chip does not depend on the wire bonding as a means of interconnection but it uses solder or bumps such as copper pillar. This means that the I/O pads can be placed at any section of the surface of the chip and therefore the chip size can be reduced with an appropriate circuitry path. This is attributed to the fact that the absence of a bonding wire contributes to the minimization of signal inductance.